Invention Grant
- Patent Title: Control device and method of manufacturing thereof
- Patent Title (中): 控制装置及其制造方法
-
Application No.: US12039472Application Date: 2008-02-28
-
Publication No.: US07924572B2Publication Date: 2011-04-12
- Inventor: Takuya Mayuzumi , Shuji Eguchi , Masahiro Sasaki , Kiyoomi Kadoya
- Applicant: Takuya Mayuzumi , Shuji Eguchi , Masahiro Sasaki , Kiyoomi Kadoya
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Crowell & Moring LLP
- Priority: JP2004-293183 20041006
- Main IPC: H05K5/00
- IPC: H05K5/00
Abstract:
A module comprises a metallic terminal pins for connection and a circuit board with electronic components mounted thereon, a circuit board connecting side of the connector. The electronic components and the circuit board with the electronic components mounted thereon are encapsulated with the same resin. A metallic base is united to the module to obtain an electric conduction between the metallic base and the circuit board.
Public/Granted literature
- US20080165511A1 Control Device and Method of Manufacturing Thereof Public/Granted day:2008-07-10
Information query
