Invention Grant
- Patent Title: Substrate for AC/AC multiple-phase power converter
- Patent Title (中): 交流/交流多相电源转换器基板
-
Application No.: US12330123Application Date: 2008-12-08
-
Publication No.: US07924586B2Publication Date: 2011-04-12
- Inventor: Abdallah Mechi
- Applicant: Abdallah Mechi
- Applicant Address: JP Osaka
- Assignee: Daikin Industries, Ltd.
- Current Assignee: Daikin Industries, Ltd.
- Current Assignee Address: JP Osaka
- Agency: Global IP Counselors
- Priority: JP2002-221916 20020730; JP2003-121038 20030425
- Main IPC: H02M1/00
- IPC: H02M1/00

Abstract:
A substrate includes a plurality of input ends, a plurality of output ends, first and second direct-current power lines, a first region and a second region. An alternating voltage is applied between any two of the input ends. The first region permits mounting of any one of a plurality of kinds of first surface-mount devices that selectively establishes electrical continuity between one of said plurality of input ends and either said first or said second direct-current power line. The second region permits mounting of a second surface-mount device that selectively establishes electrical continuity between one of said plurality of output ends and said first or said second direct-current power line.
Public/Granted literature
- US20090090546A1 SUBSTRATE FOR AC/AC MULTIPLE-PHASE POWER CONVERTER Public/Granted day:2009-04-09
Information query