Invention Grant
- Patent Title: Communication device with stickup structure
- Patent Title (中): 具有粘贴结构的通讯装置
-
Application No.: US11806939Application Date: 2007-06-05
-
Publication No.: US07925310B2Publication Date: 2011-04-12
- Inventor: Chi-Sheng Chiu
- Applicant: Chi-Sheng Chiu
- Applicant Address: TW Hsinchu
- Assignee: Accton Technology Corporation
- Current Assignee: Accton Technology Corporation
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, PC
- Agent Justin King
- Main IPC: H04M1/00
- IPC: H04M1/00

Abstract:
The present invention provides a communication device comprising an upper panel having a display unit disposed thereon, and a lower panel having a plurality of keys disposed thereon; and a stickup structure having a first rail disposed on the lower surface of the upper panel and a second rail disposed on the lower panel, the first rail engaging to the second rail, wherein the upper panel is moveable along the second rail and could be stickup by the stickup structure.
Public/Granted literature
- US20080304215A1 Communication device with stickup structure Public/Granted day:2008-12-11
Information query