Invention Grant
- Patent Title: Tactile sensing array and manufacturing method thereof
- Patent Title (中): 触觉传感阵列及其制造方法
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Application No.: US12476248Application Date: 2009-06-01
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Publication No.: US07926366B2Publication Date: 2011-04-19
- Inventor: Yao-Joe Yang , Ming-Yuan Cheng , Chen-Mo Taso
- Applicant: Yao-Joe Yang , Ming-Yuan Cheng , Chen-Mo Taso
- Applicant Address: TW Taipei
- Assignee: National Taiwan University
- Current Assignee: National Taiwan University
- Current Assignee Address: TW Taipei
- Agency: Muncy, Geissler, Olds & Lowe, PLLC
- Priority: TW98106896A 20090303
- Main IPC: G01D7/00
- IPC: G01D7/00

Abstract:
In a tactile sensing array and its manufacturing method, the tactile sensing array includes first and second electrodes at different layers, conductors provided for cladding intersection positions of the first and second electrodes, and a cladding layer for cladding the first and second electrodes and conductors. Each of the first and second electrodes is a spiral conducting wire wound onto an elastic wire. During manufacture, a cladding layer solution is injected into a mold; first electrodes are installed in rows and apart, and each first electrode includes conductor solution drops; second electrodes are installed at the conductor solution drops; a cladding layer solution is injected again; and vacuum, heating and demolding process are performed. The invention has the effects of high extensibility, high elasticity and low manufacturing cost and prevents damages caused by high deformation when the tactile sensing array is used and covered onto a complicated surface.
Public/Granted literature
- US20100224010A1 TACTILE SENSING ARRAY AND MANUFACTURING METHOD THEREOF Public/Granted day:2010-09-09
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