Invention Grant
- Patent Title: Method for producing metal/ceramic bonding substrate
- Patent Title (中): 金属/陶瓷接合基板的制造方法
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Application No.: US11729221Application Date: 2007-03-28
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Publication No.: US07926543B2Publication Date: 2011-04-19
- Inventor: Akira Sugawara , Takayuki Takahashi
- Applicant: Akira Sugawara , Takayuki Takahashi
- Applicant Address: JP Tokyo
- Assignee: Dowa Metaltech Co., Ltd
- Current Assignee: Dowa Metaltech Co., Ltd
- Current Assignee Address: JP Tokyo
- Agency: Bachman & LaPointe, P.C.
- Priority: JP2006-099358 20060331; JP2007-059364 20070309
- Main IPC: B22D19/00
- IPC: B22D19/00

Abstract:
After a molten metal of aluminum or an aluminum alloy having a temperature, which is higher than the liquidus line temperature of aluminum or the aluminum alloy by 5 to 200° C., is injected into a mold, when the mold is cooled to solidify the molten metal, the molten metal injected into the mold is pressurized at a pressure of 1.0 to 100 kPa from a high-temperature side to a low-temperature side, and the mean cooling rate is set to be 5 to 100° C./minute while the mold is cooled from the liquidus line temperature to 450° C., the temperature gradient formed in the mold being set to be in the range of from 1° C./cm to 50° C./cm.
Public/Granted literature
- US20070227685A1 Method for producing metal/ceramic bonding substrate Public/Granted day:2007-10-04
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