Invention Grant
- Patent Title: Underfill formulation and method of increasing an adhesion property of same
- Patent Title (中): 底部填充剂配方和增加其粘附性的方法
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Application No.: US11857441Application Date: 2007-09-19
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Publication No.: US07926697B2Publication Date: 2011-04-19
- Inventor: Linda Shekhawat , Gregory S. Constable , Youzhi E. Xu , Nisha Ananthakrishan
- Applicant: Linda Shekhawat , Gregory S. Constable , Youzhi E. Xu , Nisha Ananthakrishan
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agent Kenneth A. Nelson
- Main IPC: B23K31/02
- IPC: B23K31/02 ; B23K35/22
Abstract:
An underfill formulation includes a solvent (110), a plurality of amphiphilic block copolymers (120) in the solvent, and an adhesion promoter (130) in the solvent. Groups of the plurality of amphiphilic block copolymers form a plurality of micelles (140) in the solvent, with the micelles including a core (141) and a shell (142) surrounding the core, and the adhesion promoter is in the core of at least some of the plurality of micelles.
Public/Granted literature
- US20090076220A1 UNDERFILL FORMULATION AND METHOD OF INCREASING AN ADHESION PROPERTY OF SAME Public/Granted day:2009-03-19
Information query
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