Invention Grant
US07927089B2 Mold, apparatus including mold, pattern transfer apparatus, and pattern forming method
有权
模具,包括模具的装置,图案转印装置和图案形成方法
- Patent Title: Mold, apparatus including mold, pattern transfer apparatus, and pattern forming method
- Patent Title (中): 模具,包括模具的装置,图案转印装置和图案形成方法
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Application No.: US11447857Application Date: 2006-06-07
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Publication No.: US07927089B2Publication Date: 2011-04-19
- Inventor: Junichi Seki , Masao Majima , Nobuhito Suehira
- Applicant: Junichi Seki , Masao Majima , Nobuhito Suehira
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2005-167919 20050608
- Main IPC: B29C59/00
- IPC: B29C59/00 ; B29C35/08 ; B28B17/00

Abstract:
A deformable mold includes a first surface at which an imprinting pattern is formed. The imprinting pattern (i) is used to imprint a pattern on a substrate and (ii) has a variable size, which varies based on an amount of deformation of the imprinting pattern. A second surface is located opposite from the first surface in a direction of thickness of the mold. A plurality of heat generating members that generate heat have a permeability to ultraviolet light and are disposed at one of (i) the second surface and (ii) between the first surface and the second surface, and the plurality of heat generating members directly contact the mold in order to control the amount of deformation of the imprinting pattern to vary the size of the imprinting pattern. A controller independently controls the plurality of heat generating members and the controller controls at least one of the heat generating members so as to effect anisotropic size correction of the mold in an in-plane direction of the mold.
Public/Granted literature
- US20060279022A1 Mold, apparatus including mold, pattern transfer apparatus, and pattern forming method Public/Granted day:2006-12-14
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