Invention Grant
- Patent Title: Assembling structure of network patch panel and patch module
- Patent Title (中): 网络接线板和贴片模块的组装结构
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Application No.: US12485445Application Date: 2009-06-16
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Publication No.: US07927107B2Publication Date: 2011-04-19
- Inventor: John Peng , Ying-Shang Lo
- Applicant: John Peng , Ying-Shang Lo
- Applicant Address: TW Shenkeng Shiang, Tapei County
- Assignee: John Peng
- Current Assignee: John Peng
- Current Assignee Address: TW Shenkeng Shiang, Tapei County
- Agency: Volpe and Koenig, P.C.
- Priority: TW98111315A 20090403
- Main IPC: H01R29/00
- IPC: H01R29/00 ; H02B1/056

Abstract:
A network patch panel is provided. The network patch panel includes a frame having a plurality of first indentations and a plurality of second indentations; and a patch module having a plurality of first protrusions and a plurality of second protrusions, wherein the patch module is assembled within the frame by inserting each the first protrusion into a corresponding one of the plurality of first indentations, and fixed to the frame by inserting each the second protrusion into a corresponding one of the plurality of second indentations thereof.
Public/Granted literature
- US20100255687A1 ASSEMBLING STRUCTURE OF NETWORK PATCH PANEL AND PATCH MODULE Public/Granted day:2010-10-07
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