Invention Grant
- Patent Title: Connector assembly
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Application No.: US12638042Application Date: 2009-12-15
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Publication No.: US07927147B1Publication Date: 2011-04-19
- Inventor: Richard William Shaw , Richard R. Geveshausen
- Applicant: Richard William Shaw , Richard R. Geveshausen
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: H01R13/66
- IPC: H01R13/66

Abstract:
A connector assembly can include a connector with a ground pin and a case. The case can have an electrically conductive surface. A capacitor is connected to the ground pin. The capacitor is also connected to the electrically conductive surface. The capacitor can be connected between the electrically conductive surface and the ground pin so that the electrically conductive surface and the ground pin are capacitively coupled.
Information query