Invention Grant
- Patent Title: Communications connector with multi-stage compensation
- Patent Title (中): 通讯连接器，具有多级补偿功能
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Application No.: US12540891Application Date: 2009-08-13
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Publication No.: US07927153B2Publication Date: 2011-04-19
- Inventor: Frank M. Straka , Michael K. Yuan
- Applicant: Frank M. Straka , Michael K. Yuan
- Applicant Address: US IL Tinley Park
- Assignee: Panduit Corp.
- Current Assignee: Panduit Corp.
- Current Assignee Address: US IL Tinley Park
- Agent Robert A. McCann; Zachary J. Smolinski; Christopher K. Marlow
- Main IPC: H01R24/00
- IPC: H01R24/00
Abstract:
A communication connector uses compensation circuitry to compensate for crosstalk in a network connection. Capacitors are connected between specific conducive paths in said communication connector. Inductive stubs are utilized in the compensation circuitry to improve the overall compensation performance.
Public/Granted literature
- US20100055969A1 Communications connector with multi-stage compensation Public/Granted day:2010-03-04
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