Invention Grant
- Patent Title: Method of polishing a target surface
- Patent Title (中): 抛光目标表面的方法
-
Application No.: US12126383Application Date: 2008-05-23
-
Publication No.: US07927187B2Publication Date: 2011-04-19
- Inventor: Jun Watanabe , Tetsujiro Tada , Takashi Arahata , Jun Tamura , Moriaki Akazawa , Masaru Sakamoto , Takahiko Kawasaki
- Applicant: Jun Watanabe , Tetsujiro Tada , Takashi Arahata , Jun Tamura , Moriaki Akazawa , Masaru Sakamoto , Takahiko Kawasaki
- Applicant Address: JP Tokyo
- Assignee: NIHON Micro Coating Co., Ltd.
- Current Assignee: NIHON Micro Coating Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Weaver Austin Villeneuve & Sampson LLP
- Priority: JP2007-138613 20070525
- Main IPC: B24B7/22
- IPC: B24B7/22
Abstract:
A circular polishing pad has grooves formed on the surface in a spiral pattern with its center point offset from the center of the pad. The spiral pattern is an Archimedean spiral pattern or a parabolic spiral pattern. A target object is polished by using such a polishing pad without oscillating the platen to which the polishing pad is pasted or the polishing head that holds the target object.
Public/Granted literature
- US20080293332A1 POLISHING PAD AND METHOD OF POLISHING Public/Granted day:2008-11-27
Information query
