Invention Grant
US07927440B2 Bonding method and method of manufacturing a display device 有权
接合方法和制造显示装置的方法

  • Patent Title: Bonding method and method of manufacturing a display device
  • Patent Title (中): 接合方法和制造显示装置的方法
  • Application No.: US12085806
    Application Date: 2006-11-28
  • Publication No.: US07927440B2
    Publication Date: 2011-04-19
  • Inventor: Tsutomu Matsuhira
  • Applicant: Tsutomu Matsuhira
  • Applicant Address: JP
  • Assignee: Seiko Instruments Inc.
  • Current Assignee: Seiko Instruments Inc.
  • Current Assignee Address: JP
  • Agency: Adam & Wilks
  • Priority: JP2005-346400 20051130
  • International Application: PCT/JP2006/323643 WO 20061128
  • International Announcement: WO2007/063818 WO 20070607
  • Main IPC: B32B41/00
  • IPC: B32B41/00
Bonding method and method of manufacturing a display device
Abstract:
Air bubbles or foreign objects in a transparent adhesive layer that bonds a transparent plate and a plate-like member together in full-surface contact are detected without fail. For the detection, an optical fiber or the like is used to irradiate the adhesive layer with light from a side, the cast light is guided through the adhesive layer, and a state of the adhesive layer is checked with the guided light. A check that discriminates defects in the adhesive layer from defects in the bonded transparent plate is thus made possible.
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