Invention Grant
- Patent Title: Bonding method and method of manufacturing a display device
- Patent Title (中): 接合方法和制造显示装置的方法
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Application No.: US12085806Application Date: 2006-11-28
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Publication No.: US07927440B2Publication Date: 2011-04-19
- Inventor: Tsutomu Matsuhira
- Applicant: Tsutomu Matsuhira
- Applicant Address: JP
- Assignee: Seiko Instruments Inc.
- Current Assignee: Seiko Instruments Inc.
- Current Assignee Address: JP
- Agency: Adam & Wilks
- Priority: JP2005-346400 20051130
- International Application: PCT/JP2006/323643 WO 20061128
- International Announcement: WO2007/063818 WO 20070607
- Main IPC: B32B41/00
- IPC: B32B41/00

Abstract:
Air bubbles or foreign objects in a transparent adhesive layer that bonds a transparent plate and a plate-like member together in full-surface contact are detected without fail. For the detection, an optical fiber or the like is used to irradiate the adhesive layer with light from a side, the cast light is guided through the adhesive layer, and a state of the adhesive layer is checked with the guided light. A check that discriminates defects in the adhesive layer from defects in the bonded transparent plate is thus made possible.
Public/Granted literature
- US20090038734A1 Bonding Method and Method of Manufacturing a Display Device Public/Granted day:2009-02-12
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