Invention Grant
US07927662B2 CVD method in vertical CVD apparatus using different reactive gases
有权
使用不同反应气体的立式CVD装置中的CVD法
- Patent Title: CVD method in vertical CVD apparatus using different reactive gases
- Patent Title (中): 使用不同反应气体的立式CVD装置中的CVD法
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Application No.: US12098315Application Date: 2008-04-04
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Publication No.: US07927662B2Publication Date: 2011-04-19
- Inventor: Hiroyuki Matsuura
- Applicant: Hiroyuki Matsuura
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: C23C16/30
- IPC: C23C16/30

Abstract:
A method of performing a CVD process on target substrates all together in a vertical CVD apparatus includes repeating, a plurality of times, first and second steps of supplying first and second reactive gases, respectively. The first reactive gas has a vapor pressure of 1.33 kPa or less, or a bond-dissociation energy of 250 kJ/mol or less. The second reactive gas has a vapor pressure of 2.66 kPa or more, and a bond-dissociation energy of 250 kJ/mol or more. The first reactive gas is supplied from a first delivery hole disposed at a bottom of the process chamber. The second reactive gas is supplied from a plurality of second delivery holes arrayed in a vertical direction at a position adjacent to edges of the target substrates entirely over a vertical length of the target substrates stacked at intervals.
Public/Granted literature
- US20080213478A1 VERTICAL CVD APPARATUS AND CVD METHOD USING THE SAME Public/Granted day:2008-09-04
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