Invention Grant
US07927691B2 Film adhesive of thermoset resin, curing agent and fibrous micropulp
有权
热固性树脂,固化剂和纤维状微粉的胶粘剂
- Patent Title: Film adhesive of thermoset resin, curing agent and fibrous micropulp
- Patent Title (中): 热固性树脂,固化剂和纤维状微粉的胶粘剂
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Application No.: US12417691Application Date: 2009-04-03
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Publication No.: US07927691B2Publication Date: 2011-04-19
- Inventor: Subhotosh Khan , Halvar Young Loken
- Applicant: Subhotosh Khan , Halvar Young Loken
- Applicant Address: US DE Wilmington
- Assignee: E.I. du Pont de Nemours and Company
- Current Assignee: E.I. du Pont de Nemours and Company
- Current Assignee Address: US DE Wilmington
- Main IPC: C08L23/00
- IPC: C08L23/00 ; C08L27/06 ; C08L27/08 ; C08L27/12 ; C08L29/04 ; C08L33/20 ; C08L61/06 ; C08L63/00 ; C08L63/02 ; C08L63/04 ; C08L67/02 ; C08L75/04 ; C08L77/06 ; C08L77/10 ; C08L81/04

Abstract:
A prepreg composite material that includes a fiber layer and a resin comprising a thermoset resin component, a curing agent and a fibrous micropulp. The micropulp component is an aramid fiber having a volume average length of from 0.01 to 100 micrometers. The prepreg is useful in composite panel construction for minimizing fluid permeation into the cured structure. This prepreg is particularly suitable for making honeycomb sandwich panels. Film adhesives, liquid and paste resins containing aramid fiber micropulp are also disclosed.
Public/Granted literature
- US20090252920A1 COMPOSITE PANELS HAVING IMPROVED FLUID IMPERMEABILITY Public/Granted day:2009-10-08
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