Invention Grant
US07927707B2 Plate material and manufacturing method thereof 有权
板材及其制造方法

  • Patent Title: Plate material and manufacturing method thereof
  • Patent Title (中): 板材及其制造方法
  • Application No.: US10554709
    Application Date: 2004-10-05
  • Publication No.: US07927707B2
    Publication Date: 2011-04-19
  • Inventor: Hiraku Kawasaki
  • Applicant: Hiraku Kawasaki
  • Applicant Address: JP Osaka
  • Assignee: Daikin Industries, Ltd.
  • Current Assignee: Daikin Industries, Ltd.
  • Current Assignee Address: JP Osaka
  • Agency: Global IP Counselors
  • Priority: JP2003-350585 20031009
  • International Application: PCT/JP2004/014633 WO 20041005
  • International Announcement: WO2005/035239 WO 20050421
  • Main IPC: B32B15/20
  • IPC: B32B15/20
Plate material and manufacturing method thereof
Abstract:
A plate material includes a substrate and a coating. The substrate is a plate-like member that does not have protrusions and depressions of submicron order oriented in the thickness direction thereof. The coating is formed on the surface of the substrate with a paint-like material having affinity with respect to the substrate.
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