A polyamide molding composition having the constitution from 30 to 100% by weight of at least one 10T/6T copolyamide composed of from 40 to 95 mol % of 10T units, and from 5 to 60 mol % of 6T units, from 0 to 70% by weight of reinforcing materials and/or fillers, and from 0 to 50% by weight of additives and/or further polymers. Uses and processes for the preparation of this polyamide molding composition are described.