Invention Grant
US07927778B2 Chemically amplified positive photoresist composition for thick film, thick-film photoresist laminated product, manufacturing method for thick-film resist pattern, and manufacturing method for connection terminal
有权
化学扩增用于厚膜,厚膜光致抗蚀剂层压产品的正性光致抗蚀剂组合物,厚膜抗蚀剂图案的制造方法和连接端子的制造方法
- Patent Title: Chemically amplified positive photoresist composition for thick film, thick-film photoresist laminated product, manufacturing method for thick-film resist pattern, and manufacturing method for connection terminal
- Patent Title (中): 化学扩增用于厚膜,厚膜光致抗蚀剂层压产品的正性光致抗蚀剂组合物,厚膜抗蚀剂图案的制造方法和连接端子的制造方法
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Application No.: US11025833Application Date: 2004-12-29
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Publication No.: US07927778B2Publication Date: 2011-04-19
- Inventor: Toshiki Okui , Koichi Misumi
- Applicant: Toshiki Okui , Koichi Misumi
- Applicant Address: JP Kawasaki-shi
- Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee Address: JP Kawasaki-shi
- Agency: Knobbe, Martens, Olson & Bear, LLP
- Main IPC: G03C1/00
- IPC: G03C1/00 ; G03F7/00

Abstract:
A chemically amplified positive photoresist composition for thick film that is used for forming a thick-film photoresist layer with a film thickness of 10 to 150 μm on top of a support, including (A) a compound that generates acid on irradiation with active light or radiation, and (B) a resin that displays increased alkali solubility under the action of acid, wherein the component (B) comprises a resin containing a structural unit (b1) with a specific structure, and another resin containing a structural unit (b2) with a specific structure.
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