Invention Grant
US07927898B2 Apparatus and methods for packaging electronic devices for optical testing
失效
用于包装电子设备进行光学测试的装置和方法
- Patent Title: Apparatus and methods for packaging electronic devices for optical testing
- Patent Title (中): 用于包装电子设备进行光学测试的装置和方法
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Application No.: US12534556Application Date: 2009-08-03
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Publication No.: US07927898B2Publication Date: 2011-04-19
- Inventor: Alberto Tosi , Franco Stellari , Peilin Song
- Applicant: Alberto Tosi , Franco Stellari , Peilin Song
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: F. Chau & Associates, LLC
- Agent Anne V. Dougherty, Esq.
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
Apparatus and methods are provided for packaging IC (integrated circuit) chips to enable both optical access to the back side of an IC chip and electrical access to the front side of the IC chip.
Public/Granted literature
- US20090284736A1 Apparatus and Methods for Packaging Electronic Devices for Optical Testing Public/Granted day:2009-11-19
Information query
IPC分类:
