Invention Grant
- Patent Title: Capacitive bypass
- Patent Title (中): 电容旁路
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Application No.: US12582095Application Date: 2009-10-20
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Publication No.: US07927903B2Publication Date: 2011-04-19
- Inventor: Joel Kindem , Lars Carlson
- Applicant: Joel Kindem , Lars Carlson
- Applicant Address: US CA Poway
- Assignee: Digirad Corporation
- Current Assignee: Digirad Corporation
- Current Assignee Address: US CA Poway
- Agency: Law Office of Scott C. Harris, Inc.
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
An indirect connection to and across a photodiode array. The backside contact is used as one portion which connects to a capacitor. The capacitor forms a shunt across the bulk substrate, thus shunting across the series resistance of the substrate, and reducing the series resistance.
Public/Granted literature
- US20100038738A1 Capacitive Bypass Public/Granted day:2010-02-18
Information query
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