Invention Grant
US07927916B2 Optic wafer with reliefs, wafer assembly including same and methods of dicing wafer assembly
有权
具有浮雕的光晶片，包括其的晶片组件以及切割晶片组件的方法
- Patent Title: Optic wafer with reliefs, wafer assembly including same and methods of dicing wafer assembly
- Patent Title (中): 具有浮雕的光晶片，包括其的晶片组件以及切割晶片组件的方法
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Application No.: US11732691Application Date: 2007-04-04
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Publication No.: US07927916B2Publication Date: 2011-04-19
- Inventor: Rickie C. Lake
- Applicant: Rickie C. Lake
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
An optic wafer for assembly with an imager wafer, the optic wafer comprising a plurality of reliefs in a surface thereof coincident with street locations separating mutually adjacent optic element locations. A wafer assembly that includes the optic wafer and an imager wafer and methods of dicing a wafer assembly are also disclosed.
Public/Granted literature
- US20080246066A1 Optic wafer with reliefs, wafer assembly including same and methods of dicing wafer assembly Public/Granted day:2008-10-09
Information query
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