Invention Grant
- Patent Title: Packaged products, including stacked package modules, and methods of forming same
- Patent Title (中): 封装产品，包括堆叠封装模块及其形成方法
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Application No.: US12479407Application Date: 2009-06-05
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Publication No.: US07927918B2Publication Date: 2011-04-19
- Inventor: Ken M. Lam
- Applicant: Ken M. Lam
- Applicant Address: US CA San Jose
- Assignee: Atmel Corporation
- Current Assignee: Atmel Corporation
- Current Assignee Address: US CA San Jose
- Agency: Schwegman, Lundberg & Woessner, P.A.
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L21/50 ; H01L23/02 ; H01L21/44 ; H01L23/34 ; H01L29/40 ; H01L23/48 ; H01L23/62
Abstract:
An apparatus and a method for packaging semiconductor devices. The apparatus is a three-dimensional electronic package comprising one or more electronic components, a plurality of electrical contact pads, and a plurality of electrically conductive three-dimensional plugs formed through an encapsulant. Specific ones of the plurality of electrical contact pads are electrically coupled to the one or more electronic components on an uppermost surface of the plurality of electrical contact pads. The encapsulant is formed over and covers the one or more electronic devices. The plurality of three-dimensional plugs have a first end extending from at least the uppermost portion of one or more of the plurality of electrical contact pads and a second end extending substantially to an uppermost surface of the encapsulant.
Public/Granted literature
- US20090302449A1 PACKAGED PRODUCTS, INCLUDING STACKED PACKAGE MODULES, AND METHODS OF FORMING SAME Public/Granted day:2009-12-10
Information query
IPC分类:
