Invention Grant
- Patent Title: Electronic packages with fine particle wetting and non-wetting zones
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Application No.: US12756380Application Date: 2010-04-08
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Publication No.: US07927925B2Publication Date: 2011-04-19
- Inventor: Nirupama Chakrapani , Vijay S. Wakharkar , Chris Matayabas
- Applicant: Nirupama Chakrapani , Vijay S. Wakharkar , Chris Matayabas
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Trop, Pruner & Hu, P.C.
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
Spreading or keep out zones may be formed in integrated circuit packages by altering the roughness of package surfaces. The surface roughness can be altered by applying or growing particles having a dimension less than 500 nanometers. Hydrophilic surfaces may be made hemi-wicking and hydrophobic surfaces may be made hemi-wicking by particles of the same general characteristics.
Public/Granted literature
- US20100190302A1 Electronic Packages with Fine Particle Wetting and Non-Wetting Zones Public/Granted day:2010-07-29
Information query
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