Invention Grant
- Patent Title: Tungsten-doped indium oxide structures and methods
- Patent Title (中): 掺杂钨的氧化铟结构及方法
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Application No.: US11706498Application Date: 2007-02-13
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Publication No.: US07927996B2Publication Date: 2011-04-19
- Inventor: Kie Y. Ahn , Leonard Forbes
- Applicant: Kie Y. Ahn , Leonard Forbes
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Schwegman, Lundberg & Woessner, P.A.
- Main IPC: H01L21/441
- IPC: H01L21/441

Abstract:
Methods of forming transparent conducting oxides and devices formed by these methods are shown. Monolayers that contain tungsten and monolayers that contain indium are deposited onto a substrate and subsequently processed to form tungsten-doped indium oxide. The resulting transparent conducing oxide includes properties such as an amorphous or nanocrystalline microstructure. Devices that include transparent conducing oxides formed with these methods have better step coverage over substrate topography and more robust film mechanical properties.
Public/Granted literature
- US20080194094A1 Tungsten-doped indium oxide structures and methods Public/Granted day:2008-08-14
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