Invention Grant
US07928323B2 Wiring unit, method for producing wiring unit, liquid jetting apparatus, and method for producing liquid jetting apparatus
有权
布线单元，布线单元的制造方法，液体喷射装置以及液体喷射装置的制造方法
- Patent Title: Wiring unit, method for producing wiring unit, liquid jetting apparatus, and method for producing liquid jetting apparatus
- Patent Title (中): 布线单元，布线单元的制造方法，液体喷射装置以及液体喷射装置的制造方法
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Application No.: US12218795Application Date: 2008-07-17
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Publication No.: US07928323B2Publication Date: 2011-04-19
- Inventor: Shuhei Hiwada
- Applicant: Shuhei Hiwada
- Applicant Address: JP Aichi-Ken
- Assignee: Brother Kogyo Kabushiki Kaisha
- Current Assignee: Brother Kogyo Kabushiki Kaisha
- Current Assignee Address: JP Aichi-Ken
- Agency: Frommer Lawrence & Haug LLP
- Priority: JP2007-187659 20070718; JP2007-188672 20070719
- Main IPC: H05K1/11
- IPC: H05K1/11
Abstract:
A wiring unit includes a first insulating layer which is provided with an electrode and a wire electrically connected to the electrode on one surface of the first insulating layer; a second insulating layer which is formed on the one surface of the first insulating layer and which covers the wire; an adhesive layer which is formed on a surface, of the second insulating layer, not facing the first insulating layer; a through hole which is formed through the adhesive layer and the second insulating layer and in which the electrode is exposed; a protective sheet which is detachably adhered on a surface, of the adhesive layer, not facing the second insulating layer, and; and a liquid electroconductive material which is filled in a space defined by the through hole, the electrode exposed in the through hole, and the protective sheet.
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