Invention Grant
- Patent Title: Thermoformed EMI shield
- Patent Title (中): 热成型EMI屏蔽
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Application No.: US12394884Application Date: 2009-02-27
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Publication No.: US07928326B2Publication Date: 2011-04-19
- Inventor: Mark S Tracy , Jeffrey A Lev , Paul N Walker
- Applicant: Mark S Tracy , Jeffrey A Lev , Paul N Walker
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agent Michael S. Czarnecki
- Main IPC: H05K9/00
- IPC: H05K9/00

Abstract:
Systems and methods for minimizing the transmission and reception of electromagnetic interference (“EMI”) are provided. A member having first and second sides and at least one edge can be formed to correspond to the interior of an enclosure. At least one aperture can penetrate the member from the first side to the second side, forming at least one internal edge. A conductive layer can be disposed on or about the first side, the second side, the at least one edge, and the at least one internal edge of the member, thereby encapsulating the member.
Public/Granted literature
- US20100218987A1 THERMOFORMED EMI SHIELD Public/Granted day:2010-09-02
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