Invention Grant
- Patent Title: Apparatus for machining a workpiece using wire discharge including an upper and lower power supply unit
- Patent Title (中): 用于使用包括上下电源单元的放线加工工件的装置
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Application No.: US11883999Application Date: 2006-10-24
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Publication No.: US07928337B2Publication Date: 2011-04-19
- Inventor: Yasuo Onodera , Tatsushi Sato , Yoshikazu Ukai , Takashi Hashimoto , Koichiro Hattori , Hisashi Yamada
- Applicant: Yasuo Onodera , Tatsushi Sato , Yoshikazu Ukai , Takashi Hashimoto , Koichiro Hattori , Hisashi Yamada
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- International Application: PCT/JP2006/321179 WO 20061024
- International Announcement: WO2008/050405 WO 20080502
- Main IPC: B23H7/04
- IPC: B23H7/04 ; B23H1/02

Abstract:
A wire-discharge machining apparatus controls a short circuit between a wire electrode and a workpiece and wire-breakage, and makes it easy to improve productivity, by performing power supply control to mix an upper-side power supply state in which a high-frequency pulse voltage is applied from an upper-side power supplying unit, a lower-side power supply state in which the high-frequency pulse voltage is applied from a lower-side power supplying unit, and a both-sides power supply state in which the high-frequency pulse voltage is applied to the wire electrode from both power supplying units in synchronization with each other during a period of electric discharge machining.
Public/Granted literature
- US20100133237A1 Wire-Discharge Machining Apparatus Public/Granted day:2010-06-03
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