Invention Grant
- Patent Title: Micropillar array electrospray chip
- Patent Title (中): 微柱阵列电喷雾芯片
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Application No.: US11934540Application Date: 2007-11-02
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Publication No.: US07928368B2Publication Date: 2011-04-19
- Inventor: Teemu Nissila , Lauri Sainiemi , Raimo Ketola , Samuli Franssila , Risto Kostiainen , Tapio Kotiaho
- Applicant: Teemu Nissila , Lauri Sainiemi , Raimo Ketola , Samuli Franssila , Risto Kostiainen , Tapio Kotiaho
- Applicant Address: FI Helsinki
- Assignee: Licentia Oy
- Current Assignee: Licentia Oy
- Current Assignee Address: FI Helsinki
- Agency: Sughrue Mion, PLLC
- Main IPC: H01J49/10
- IPC: H01J49/10

Abstract:
The invention relates to an electrospray ionization (ESI) device for forming a stream of ionized sample molecules. The device comprises a sample introduction zone for receiving a liquid-form sample, a tip for spraying the sample into aerosol or gaseous form, and a flow channel connecting the sample introduction zone and the tip. According to the invention, the flow channel comprises an array of transversely oriented microstructures adapted to passively transport the liquid-form sample introduced to the sample introduction zone to the tip by means of capillary forces. The invention concerns also a manufacturing method and applications of the ESI device, in particular mass spectrometry. The device can be used without external pumping of sample liquid.
Public/Granted literature
- US20090114814A1 MICROPILLAR ARRAY ELECTROSPRAY CHIP Public/Granted day:2009-05-07
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