Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
-
Application No.: US12570767Application Date: 2009-09-30
-
Publication No.: US07928494B2Publication Date: 2011-04-19
- Inventor: Eiji Sakagami , Makoto Nakashima
- Applicant: Eiji Sakagami , Makoto Nakashima
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2005-291231 20051004
- Main IPC: H01L29/76
- IPC: H01L29/76

Abstract:
The semiconductor device of the present invention includes a semiconductor substrate, a plurality of floating gate electrodes formed in a memory cell forming region of the semiconductor substrate, a word line electrically connecting the floating gate electrodes and a conductor portion formed on the word line so as to reduce a resistance of the word line.
Public/Granted literature
- US20100019305A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2010-01-28
Information query
IPC分类: