Invention Grant
US07928511B2 Semiconductor device and method for manufacturing semiconductor device 有权
半导体装置及半导体装置的制造方法

  • Patent Title: Semiconductor device and method for manufacturing semiconductor device
  • Patent Title (中): 半导体装置及半导体装置的制造方法
  • Application No.: US12066629
    Application Date: 2006-08-10
  • Publication No.: US07928511B2
    Publication Date: 2011-04-19
  • Inventor: Chihiro Arai
  • Applicant: Chihiro Arai
  • Applicant Address: JP Tokyo
  • Assignee: Sony Corporation
  • Current Assignee: Sony Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: K&L Gates LLP
  • Priority: JPP2005-263366 20050912
  • International Application: PCT/JP2006/315837 WO 20060810
  • International Announcement: WO2007/032165 WO 20070322
  • Main IPC: H01L29/78
  • IPC: H01L29/78
Semiconductor device and method for manufacturing semiconductor device
Abstract:
A semiconductor device (1) includes a plurality of photodiodes (20) on a semiconductor substrate (11). Cathodes (22) and a common anode (21) of the plurality of photodiodes (20 (20a, 20b)) are formed so as to be electrically independent from the semiconductor substrate (11), the plurality of photodiodes (20) have the common anode (21) and the plurality of separate cathodes (22), and an output of the common anode (21) is considered to be equivalent to a sum of outputs of the plurality of separate photodiodes (20). Alternatively, the plurality of photodiodes have a common cathode and a plurality of separate anodes, and an output of the common cathode is considered to be equivalent to a sum of outputs of a plurality of separate photodiodes. By completely electrically isolating the anode and the cathode of the photodiodes from the substrate, the noise characteristic can be reduced, and crosstalk can be reduced.
Information query
IPC分类:
H 电学
H01 基本电气元件
H01L 半导体器件;其他类目中不包括的电固体器件(使用半导体器件的测量入G01;一般电阻器入H01C;磁体、电感器、变压器入H01F;一般电容器入H01G;电解型器件入H01G9/00;电池组、蓄电池入H01M;波导管、谐振器或波导型线路入H01P;线路连接器、汇流器入H01R;受激发射器件入H01S;机电谐振器入H03H;扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R;一般电光源入H05B;印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K;在具有特殊应用的电路中使用的半导体器件见应用相关的小类)
H01L29/00 专门适用于整流、放大、振荡或切换,并具有至少一个电位跃变势垒或表面势垒的半导体器件;具有至少一个电位跃变势垒或表面势垒,例如PN结耗尽层或载流子集结层的电容器或电阻器;半导体本体或其电极的零部件(H01L31/00至H01L47/00,H01L51/05优先;除半导体或其电极之外的零部件入H01L23/00;由在一个共用衬底内或其上形成的多个固态组件组成的器件入H01L27/00)
H01L29/66 .按半导体器件的类型区分的
H01L29/68 ..只能通过对一个不通有待整流、放大或切换的电流的电极供给电流或施加电位方可进行控制的(H01L29/96优先)
H01L29/76 ...单极器件
H01L29/772 ....场效应晶体管
H01L29/78 .....由绝缘栅产生场效应的
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