Invention Grant
- Patent Title: Semiconductor device and method for manufacturing semiconductor device
- Patent Title (中): 半导体装置及半导体装置的制造方法
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Application No.: US12066629Application Date: 2006-08-10
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Publication No.: US07928511B2Publication Date: 2011-04-19
- Inventor: Chihiro Arai
- Applicant: Chihiro Arai
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: K&L Gates LLP
- Priority: JPP2005-263366 20050912
- International Application: PCT/JP2006/315837 WO 20060810
- International Announcement: WO2007/032165 WO 20070322
- Main IPC: H01L29/78
- IPC: H01L29/78

Abstract:
A semiconductor device (1) includes a plurality of photodiodes (20) on a semiconductor substrate (11). Cathodes (22) and a common anode (21) of the plurality of photodiodes (20 (20a, 20b)) are formed so as to be electrically independent from the semiconductor substrate (11), the plurality of photodiodes (20) have the common anode (21) and the plurality of separate cathodes (22), and an output of the common anode (21) is considered to be equivalent to a sum of outputs of the plurality of separate photodiodes (20). Alternatively, the plurality of photodiodes have a common cathode and a plurality of separate anodes, and an output of the common cathode is considered to be equivalent to a sum of outputs of a plurality of separate photodiodes. By completely electrically isolating the anode and the cathode of the photodiodes from the substrate, the noise characteristic can be reduced, and crosstalk can be reduced.
Public/Granted literature
- US20100155867A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2010-06-24
Information query
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