Invention Grant
- Patent Title: Semiconductor storage device and manufacturing method thereof
- Patent Title (中): 半导体存储装置及其制造方法
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Application No.: US12276815Application Date: 2008-11-24
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Publication No.: US07928516B2Publication Date: 2011-04-19
- Inventor: Kiyohito Nishihara
- Applicant: Kiyohito Nishihara
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2007-311418 20071130
- Main IPC: H01L29/76
- IPC: H01L29/76

Abstract:
A semiconductor storage device include a semiconductor substrate, an insulating layer provided on the semiconductor substrate and having an opening, a semiconductor layer provided on the insulating layer, the semiconductor layer having a recess at a center of a surface thereof above the opening, a memory cell unit provided on the semiconductor layer and including a plurality of memory cells, current paths of the memory cells being connected in series, a selecting transistor adjacent to the memory cell unit and arranged on a region of the semiconductor layer including the recess, the selecting transistor including a gate insulating film provided on the region of the semiconductor layer including the recess and a gate electrode provided on the gate insulating film.
Public/Granted literature
- US20090140312A1 SEMICONDUCTOR STORAGE DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2009-06-04
Information query
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