Invention Grant
- Patent Title: Package-level electromagnetic interference shielding
- Patent Title (中): 封装级电磁干扰屏蔽
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Application No.: US11538539Application Date: 2006-10-04
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Publication No.: US07928538B2Publication Date: 2011-04-19
- Inventor: James F. Salzman
- Applicant: James F. Salzman
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Lawrence J. Bassuk; W. James Brady; Frederick J. Telecky, Jr.
- Main IPC: H01L23/552
- IPC: H01L23/552
Abstract:
A shielded electronic package, comprising a semiconductor device, an insulating housing surrounding the semiconductor device and a metal coating on the insulating housing. The metal coating covers all but those portions of the insulating housing that are adjacent to connective structures on one or more mounting sides of the insulating housing.
Public/Granted literature
- US20080185692A1 PACKAGE-LEVEL ELECTROMAGNETIC INTERFERENCE SHIELDING Public/Granted day:2008-08-07
Information query
IPC分类:
