In accordance with the teachings described herein, a multilevel ground-plane for a mobile device is provided. The multilevel ground-plane includes a first conductive surface, a second conductive surface, and a conducting strip that couples the first conducting surface to the second conducting surface. A mobile device having a multilevel ground-plane may include a printed circuit board, an antenna radiating element attached to a surface of the printed circuit board, and the multilevel ground plane integral with the printed circuit board and electromagnetically coupled to the antenna radiating element.