Invention Grant
- Patent Title: Contact pressure analysis tool
- Patent Title (中): 接触压力分析工具
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Application No.: US11868035Application Date: 2007-10-05
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Publication No.: US07928996B2Publication Date: 2011-04-19
- Inventor: Donald A. Kearns , Christopher R. Ritchie
- Applicant: Donald A. Kearns , Christopher R. Ritchie
- Applicant Address: US CA Redwood City
- Assignee: Oracle America, Inc.
- Current Assignee: Oracle America, Inc.
- Current Assignee Address: US CA Redwood City
- Agency: Osha Liang LLP
- Main IPC: G09G5/00
- IPC: G09G5/00

Abstract:
A method for improving load balance involves obtaining a graphical representation of a load distribution for contacts in an integrated circuit stack, analyzing the graphical representation of the load distribution to determine contact loads, where a contact load corresponds to a contact, and designing at least one component of the integrated circuit stack, based on the contact loads.
Public/Granted literature
- US20090091905A1 CONTACT PRESSURE ANALYSIS TOOL Public/Granted day:2009-04-09
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