Invention Grant
- Patent Title: Heat dissipating assembly
- Patent Title (中): 散热组件
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Application No.: US12479967Application Date: 2009-06-08
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Publication No.: US07929293B2Publication Date: 2011-04-19
- Inventor: Liang-Liang Cao
- Applicant: Liang-Liang Cao
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Agent D. Austin Bonderer
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
A heat dissipating assembly includes a heat generating component, a heat sink, and a fan. The heat sink includes a base attached on the heat generating component and a plurality of fins attached on the base. The fan is attached to a top surface of the fins. The top surface of the fins is wider than the base. The fins incline inwardly from the top surface to the base for gathering cooling air from the fan to the base.
Public/Granted literature
- US20100284142A1 HEAT DISSIPATING ASSEMBLY Public/Granted day:2010-11-11
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