Invention Grant
- Patent Title: Fastening device and heat-dissipating module having the same
- Patent Title (中): 紧固装置和散热模块具有相同的功能
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Application No.: US12385256Application Date: 2009-04-02
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Publication No.: US07929296B2Publication Date: 2011-04-19
- Inventor: Chen Tseng
- Applicant: Chen Tseng
- Applicant Address: TW Kuei Shan Hsiang, Tao Yuan Shien
- Assignee: Quanta Computer Inc.
- Current Assignee: Quanta Computer Inc.
- Current Assignee Address: TW Kuei Shan Hsiang, Tao Yuan Shien
- Agency: Thomas, Kayden, Horstemeyer & Risley, LLP
- Priority: TW97209829U 20080604
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L23/40

Abstract:
The invention discloses a fastening device for fasten a heat sink onto a base board. The fastening device comprises a first fastening member, a second fastening member and a third fastening member. When assembling the fastening device to the base board, the second fastening member has to be pivoted with the third fastening member first. Afterwards, the first fastening member is attached to the base board. Finally, the second and third fastening members, which have been assembled, are engaged with the first fastening member, so as to press the heat sink tightly. Accordingly, the heat sink will be fastened on the base board easily and stably.
Public/Granted literature
- US20090301689A1 Fastening device and heat-dissipating module having the same Public/Granted day:2009-12-10
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