Invention Grant
US07929314B2 Method and apparatus of changing PCB pad structure to increase solder volume and strength
失效
改变PCB焊盘结构以增加焊料体积和强度的方法和装置
- Patent Title: Method and apparatus of changing PCB pad structure to increase solder volume and strength
- Patent Title (中): 改变PCB焊盘结构以增加焊料体积和强度的方法和装置
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Application No.: US12143540Application Date: 2008-06-20
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Publication No.: US07929314B2Publication Date: 2011-04-19
- Inventor: Arvind K. Sinha , Thomas S. Thompson
- Applicant: Arvind K. Sinha , Thomas S. Thompson
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Suiter Swantz pc llo
- Main IPC: H01R9/00
- IPC: H01R9/00
Abstract:
The present disclosure is directed at an apparatus for changing printed circuit board pad structure to increase solder volume and strength. The invention provides increased end row pad and lead size and utilizes a plurality of lead-to-pad and pad-to-lead conforming geometric structures to form a joint providing additional solder surface adhesion area.
Public/Granted literature
- US20090316376A1 METHOD AND APPARATUS OF CHANGING PCB PAD STRUCTURE TO INCREASE SOLDER VOLUME AND STRENGTH Public/Granted day:2009-12-24
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