Systems are described that include computer program products that enable data processing apparatus to perform operations to determine stresses for a system including a substrate with a plurality of films layered thereon. The operations include determining film stresses and system curvatures in terms of misfit strains and thicknesses the plurality of films, determining film stresses and interface shear stresses in terms of system curvature and the thicknesses of each film, and transmitting the film stresses and the interface shear stresses to a computer-readable medium.