Invention Grant
- Patent Title: Conductive pattern and method of making
- Patent Title (中): 导电图案和制作方法
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Application No.: US11584690Application Date: 2006-10-20
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Publication No.: US07930815B2Publication Date: 2011-04-26
- Inventor: James P. Coleman , David N. Edwards , Ian J. Forster , Pradeep S. Iyer , Mark A. Licon
- Applicant: James P. Coleman , David N. Edwards , Ian J. Forster , Pradeep S. Iyer , Mark A. Licon
- Applicant Address: US CA Pasadena
- Assignee: Avery Dennison Corporation
- Current Assignee: Avery Dennison Corporation
- Current Assignee Address: US CA Pasadena
- Main IPC: H01P11/00
- IPC: H01P11/00 ; G08B13/14

Abstract:
A method of forming an electrically-conductive pattern includes selectively electroplating the top portions of a substrate that corresponds to the pattern, and separating the conductive pattern from the substrate. The electroplating may also include electrically connecting the conductive pattern to an electrical component. Conductive ink, such as ink including carbon particles, may be selectively placed on the conductive substrate to facilitate plating of the desired pattern and/or to facilitate separation of the pattern from the substrate. An example of a conductive pattern is an antenna for a radio-frequency identification (RFID) device such as a label or a tag. One example of an electrical component that may be electrically connected to the antenna, is an RFID strap or chip.
Public/Granted literature
- US20070035466A1 Conductive pattern and method of making Public/Granted day:2007-02-15
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