Invention Grant
- Patent Title: Transfer assembly for manufacturing electronic devices
- Patent Title (中): 用于制造电子设备的传送组件
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Application No.: US11820603Application Date: 2007-06-19
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Publication No.: US07931063B2Publication Date: 2011-04-26
- Inventor: Gordon S. W. Craig , Kenneth D. Schatz , Mark A. Hadley , Paul S. Drzaic
- Applicant: Gordon S. W. Craig , Kenneth D. Schatz , Mark A. Hadley , Paul S. Drzaic
- Applicant Address: US CA Morgan Hill
- Assignee: Alien Technology Corporation
- Current Assignee: Alien Technology Corporation
- Current Assignee Address: US CA Morgan Hill
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: B32B37/00
- IPC: B32B37/00
Abstract:
A method for assembling a device. The method comprises placing a functional element in a first opening formed in a template substrate and transferring the functional element to a device substrate having a second opening formed therein wherein the functional element is held within the second opening and against an adhesive film coupled to the device substrate.
Public/Granted literature
- US20080156445A1 Transfer assembly for manufacturing electronic devices Public/Granted day:2008-07-03
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