Invention Grant
- Patent Title: Reduced friction molds for injection molded solder processing
- Patent Title (中): 用于注塑焊接加工的减摩摩擦模具
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Application No.: US11670080Application Date: 2007-02-01
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Publication No.: US07931249B2Publication Date: 2011-04-26
- Inventor: Mark D. Schultz
- Applicant: Mark D. Schultz
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Gail Zarick, Esq.
- Main IPC: B22D11/00
- IPC: B22D11/00 ; H05K3/00 ; H01L21/00
Abstract:
A process of reducing friction, which is encountered in molds utilized in injection molded, solder processing, and wherein glass mold plates have mold pits etched therein. The mold pates are subjected to a heat treatment so as to smooth or round-off sharp edges along the periphery of the mold pits.
Public/Granted literature
- US20080185118A1 REDUCED FRICTION MOLDS FOR INJECTION MOLDED SOLDER PROCESSING Public/Granted day:2008-08-07
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