Invention Grant
- Patent Title: Low profile board-to-board connector mating pair with solder barrier
- Patent Title (中): 薄型板对板连接器配对与焊料屏障
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Application No.: US11918763Application Date: 2006-04-18
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Publication No.: US07931477B2Publication Date: 2011-04-26
- Inventor: Toshihisa Hirata , Tetsuya Asakawa
- Applicant: Toshihisa Hirata , Tetsuya Asakawa
- Applicant Address: US IL Lisle
- Assignee: Molex Incorporated
- Current Assignee: Molex Incorporated
- Current Assignee Address: US IL Lisle
- Agent Timothy M. Morella
- Priority: JP2005-119401 20050418
- International Application: PCT/US2006/014757 WO 20060418
- International Announcement: WO2006/130252 WO 20061207
- Main IPC: H01R12/00
- IPC: H01R12/00

Abstract:
An electrical connector comprises a generally rectangular dielectric housing with a mating face and a mounting face. A plurality of terminal support posts extend in a direction from the mounting face towards the mating face and each support post has oppositely facing first and second sidewalls and a connecting surface. A plurality of terminal receiving cavities are spaced along a longitudinal axis of the housing for receiving terminals therein. A plurality of terminals are provided with each including a solder tail portion and a generally U-shaped contact portion. The solder tail portion is positioned along the mounting face and the contact portion includes a first, distal contact leg, a second, proximal contact leg spaced from and generally parallel to the first contact leg and a connecting portion extending between the first and second contact legs. The first contact leg extends along the first sidewall, the second contact leg extending along the second sidewall, and the connecting portion extending along the connecting surface.
Public/Granted literature
- US20090305528A1 Board-to-board connector pair Public/Granted day:2009-12-10
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