Invention Grant
- Patent Title: Medical capsule housing formed by thermal welding
- Patent Title (中): 医用胶囊外壳由热焊接形成
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Application No.: US11483050Application Date: 2006-07-07
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Publication No.: US07931584B2Publication Date: 2011-04-26
- Inventor: Toshimasa Akagi , Hidetake Segawa
- Applicant: Toshimasa Akagi , Hidetake Segawa
- Applicant Address: JP
- Assignee: Olympus Corporation
- Current Assignee: Olympus Corporation
- Current Assignee Address: JP
- Agency: Ostrolenk Faber LLP
- Priority: JP2004-002424 20040107; JP2004-075066 20040316
- Main IPC: A61B1/00
- IPC: A61B1/00

Abstract:
A medical capsule housing includes first and second outer members made of a resin material, both having an opening at one end. The first and second outer members are thermally welded by ultrasonic welding at an abutting portion. The abutting portion includes a sharp edged line portion which forms the opening end portion of the first outer member and an inclined surface portion which forms the opening end portion of the second outer member. The sharp edged line portion is provided in a closed space formed by the first outer member and the second outer member before the ultrasonic welding.
Public/Granted literature
- US20060252986A1 Capsule-type medical apparatus, medical capsule housing, and production method thereof Public/Granted day:2006-11-09
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