Invention Grant
- Patent Title: Non-destructive laser optical integrated circuit package marking
- Patent Title (中): 无损激光光学集成电路封装标记
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Application No.: US12242545Application Date: 2008-09-30
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Publication No.: US07931849B2Publication Date: 2011-04-26
- Inventor: Joseph Martin Patterson
- Applicant: Joseph Martin Patterson
- Applicant Address: US CA San Diego
- Assignee: Applied Micro Circuits Corporation
- Current Assignee: Applied Micro Circuits Corporation
- Current Assignee Address: US CA San Diego
- Agency: Law Offices of Gerald Maliszewski
- Agent Gerald Maliszewski
- Main IPC: B29C35/08
- IPC: B29C35/08 ; H01L21/66 ; B23K26/00
Abstract:
A method is provided for laser optically marking integrated circuit (IC) packages in a non-destructive manner. The method provides an IC die encapsulated as a package in a compound of glass spheres and epoxy. An acute angle is defined between a laser optical path and an IC package planar surface. The IC package surface is scanned with a laser, and in response to ablating the IC package surface, a legible mark on the planar surface.
Public/Granted literature
- US20090325322A1 Non-Destructive Laser Optical Integrated Circuit Package Marking Public/Granted day:2009-12-31
Information query
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