Invention Grant
- Patent Title: Photosensitive composition
- Patent Title (中): 感光组合物
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Application No.: US11594551Application Date: 2006-11-08
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Publication No.: US07932016B2Publication Date: 2011-04-26
- Inventor: Mark R. Winkle , Jill E. Steeper , Xiang-Qian Liu , Janet Okada-Coakley , Scott A. Ibbitson
- Applicant: Mark R. Winkle , Jill E. Steeper , Xiang-Qian Liu , Janet Okada-Coakley , Scott A. Ibbitson
- Applicant Address: US MA Marlborough
- Assignee: Rohm and Haas Electronic Materials LLC
- Current Assignee: Rohm and Haas Electronic Materials LLC
- Current Assignee Address: US MA Marlborough
- Agent Jonathan D. Baskin
- Main IPC: G03F7/028
- IPC: G03F7/028 ; G03F7/027 ; G03F7/033
Abstract:
Photoresist compositions and methods suitable for depositing a thick photoresist layer in a single coating application are provided. Such photoresist layers are particularly suitable for use in chip scale packaging, for example, in the formation of metal bumps.
Public/Granted literature
- US20070105046A1 Photosensitive composition Public/Granted day:2007-05-10
Information query
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