Invention Grant
US07932094B2 Method and apparatus for determining the stability of an electroless plating bath 有权
用于确定化学镀浴的稳定性的方法和装置

Method and apparatus for determining the stability of an electroless plating bath
Abstract:
The stability of an electroless plating bath for depositing a metal (e.g., nickel) is determined by titrating a sample of the plating bath with a titrant comprising ions of a catalytic metal (e.g., palladium) and detecting hydrogen released at the titration endpoint. The quantity of titrant required to attain the endpoint provides a measure of the stability of the electroless plating bath.
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