Invention Grant
- Patent Title: Organosilicon compound and pressure-sensitive adhesive composition for liquid crystal element containing same
- Patent Title (中): 有机硅化合物和含有其的液晶元件的压敏粘合剂组合物
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Application No.: US12275605Application Date: 2008-11-21
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Publication No.: US07932312B2Publication Date: 2011-04-26
- Inventor: Hideyoshi Yanagisawa
- Applicant: Hideyoshi Yanagisawa
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2007-303738 20071122; JP2007-303739 20071122
- Main IPC: C08K5/24
- IPC: C08K5/24 ; C07F7/04

Abstract:
A novel organosilicon compound having a β-ketoester structure and a pressure-sensitive adhesive composition for a liquid crystal element that includes the organosilicon compound are provided. The organosilicon compound is obtained by reacting, in the presence of a transition metal catalyst, a compound represented by a formula (1): [wherein, R1 represents H or Me, R2 to R4 represent divalent hydrocarbon groups, A represents a group of a formula (i): (wherein, R6 represents an alkyl group or a phenyl group), R5 represents a group of a formula (ii): (wherein, B represents OH or a group represented by the formula (i)), and p, q and r represent integers of 0 to 6] with an alkoxysilane represented by a formula (2): (R7O)m(R8)(3-m)Si—H (2) [wherein, R7 and R8 represent monovalent hydrocarbon groups of 1 to 4 carbon atoms, and m represents 1, 2 or 3].
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