Invention Grant
- Patent Title: Laser processing machine
- Patent Title (中): 激光加工机
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Application No.: US12048616Application Date: 2008-03-14
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Publication No.: US07932478B2Publication Date: 2011-04-26
- Inventor: Keiji Nomaru , Hiroshi Morikazu , Taiki Sawabe
- Applicant: Keiji Nomaru , Hiroshi Morikazu , Taiki Sawabe
- Applicant Address: JP Tokyo
- Assignee: Disco Corporation
- Current Assignee: Disco Corporation
- Current Assignee Address: JP Tokyo
- Agency: Greer, Burns & Crain, Ltd.
- Priority: JP2007-099767 20070405
- Main IPC: B23K26/06
- IPC: B23K26/06 ; B23K26/36

Abstract:
A laser processing machine that includes a chuck table adapted to hold a workpiece thereon and laser beam irradiation unit for applying a laser beam to the workpiece held on the chuck table. The laser beam irradiation unit includes: a laser beam oscillation section for emitting a pulse laser beam; a defection section for deflecting the pulse laser beam emitted from the laser beam oscillation section; and a concentrator having an ellipsoidal focusing spot forming section for focusing the pulse laser beam deflected by the deflection unit and forming a focusing spot into an ellipse.
Public/Granted literature
- US20080245779A1 LASER PROCESSING MACHINE Public/Granted day:2008-10-09
Information query
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