Invention Grant
- Patent Title: Method of forming thin film patterning substrate including formation of banks
- Patent Title (中): 包括形成堤的薄膜构图衬底的形成方法
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Application No.: US12232421Application Date: 2008-09-17
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Publication No.: US07932518B2Publication Date: 2011-04-26
- Inventor: Shunichi Seki , Hiroshi Kiguchi , Ichio Yudasaka , Hiroo Miyajima
- Applicant: Shunichi Seki , Hiroshi Kiguchi , Ichio Yudasaka , Hiroo Miyajima
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP10-067508 19980317; JP11-032123 19990210
- Main IPC: H01L29/04
- IPC: H01L29/04

Abstract:
Display devices such as EL elements or LED elements, are formed from thin film elements having banks of prescribed height and a thin film layer formed by an ink jet method in areas to be coated that are partitioned by those banks. The banks may be formed of an organic material on a bank formation surface configured of an inorganic material, plasma treatment is performed under conditions that the induction gas is fluorine-based and that fluorine is present excessively, and the areas enclosed by the banks subjected to surface treatment are filled with the liquid thin film material to form the thin film layer or layers.
Public/Granted literature
- US20090020751A1 Method of forming thin film patterning substrate including formation of banks Public/Granted day:2009-01-22
Information query
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