Invention Grant
US07932563B2 Techniques for improving transistor-to-transistor stress uniformity
有权
提高晶体管至晶体管应力均匀性的技术
- Patent Title: Techniques for improving transistor-to-transistor stress uniformity
- Patent Title (中): 提高晶体管至晶体管应力均匀性的技术
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Application No.: US12363666Application Date: 2009-01-30
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Publication No.: US07932563B2Publication Date: 2011-04-26
- Inventor: Jung-Ching J. Ho , Jane W. Sowards , Shuxian Wu
- Applicant: Jung-Ching J. Ho , Jane W. Sowards , Shuxian Wu
- Applicant Address: US CA San Jose
- Assignee: Xilinx, Inc.
- Current Assignee: Xilinx, Inc.
- Current Assignee Address: US CA San Jose
- Agent Scott Hewett; LeRoy D. Maunu; Lois D. Cartier
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
An integrated circuit has a transistor with an active gate structure overlying an active diffusion area formed in a semiconductor substrate. A dummy gate structure is formed over a diffusion area and separated from the active gate structure by a selected distance (d2). A stress layer overlying the transistor array produces stress in a channel region of the transistor.
Public/Granted literature
- US20100193870A1 TECHNIQUES FOR IMPROVING TRANSISTOR-TO-TRANSISTOR STRESS UNIFORMITY Public/Granted day:2010-08-05
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