Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US12389897Application Date: 2009-02-20
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Publication No.: US07932567B2Publication Date: 2011-04-26
- Inventor: Akira Mizumura , Hiroaki Ammo , Tetsuya Oishi
- Applicant: Akira Mizumura , Hiroaki Ammo , Tetsuya Oishi
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: SNR Denton US LLP
- Priority: JP2008-063006 20080312
- Main IPC: H01L27/088
- IPC: H01L27/088

Abstract:
Disclosed herein is a semiconductor device including: first and second transistors, each of the first and second transistors being formed with a plurality of fin transistors, and the first and second transistors being connected in parallel to electrically share a source, wherein the plurality of fin transistors each include a fin activation layer, the fin activation layer protruding from a semiconductor substrate, a source layer serving as the source being formed on one end, and a drain layer on the other end of the fin activation layer so as to form a channel region, the fin activation layers are arranged adjacent to each other in parallel, and the drain layers are disposed so that the currents flow through the plurality of fin transistors in opposite directions between the first and second transistors.
Public/Granted literature
- US20090230483A1 SEMICONDUCTOR DEVICE Public/Granted day:2009-09-17
Information query
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